"dc series deep cycle battery"

Outdoor LED Display

Technical Specifications Pixel Packaging Flip-Chip COB Pixel Bonding Method Flip-Chip Bonding Pixel Pixel Composition RGB Module Pixel Pitch (mm) 0.78 0.93 1.25 1.56 1.875 Module Pixel Density (pixels/m) 1,638,400 1,137,777 640,000 409,600 284,444 Module Module Size (mm) 150168.75 150168.75 150168.75 150168.75 150168.75 Module Module Resolution 192216 160180 120135 96108 8090 Module Driving Type Constant Current PWM Cabinet Cabinet Size (WHD) (mm) 600337.544.5